Product General Information
Physical Characteristics
Electrical Characteristics
Mechanical Characteristics
Solder Process Characteristics
Environmental
Others
Key Features
Fully Enclosed Metal Shell
Improves protection, mechanical strength and stable mating performance.
Improves protection, mechanical strength and stable mating performance.
Through Hole DIP Mounting
Secures PCB retention and supports reliable reflow solder assembly.
Secures PCB retention and supports reliable reflow solder assembly.
Reliable USB 2.0 Connectivity
Provides stable data transmission and dependable electrical performance.
Provides stable data transmission and dependable electrical performance.
Typical Applications
Electronics
Consumer electronics and computing devices.
Consumer electronics and computing devices.
Industrial
Automation, control systems and robotics.
Automation, control systems and robotics.
Telecommunications
Networking and communication equipment.
Networking and communication equipment.

