Product General Information
Physical Characteristics
Electrical Characteristics
Mechanical Characteristics
Solder Process Characteristics
Environmental
Others
Key Features
Elevated Horizontal Design
Horizontal configuration with 8.0 mm height provides additional module clearance.
Horizontal configuration with 8.0 mm height provides additional module clearance.
Precise Contact Layout
Features 260 contacts at 0.50 mm pitch for DDR4 connectivity.
Features 260 contacts at 0.50 mm pitch for DDR4 connectivity.
Secure Module Retention
Stainless steel latches secure memory modules and allow convenient removal.
Stainless steel latches secure memory modules and allow convenient removal.
Typical Applications
Electronics
Consumer electronics and computing devices.
Consumer electronics and computing devices.
Industrial
Automation, control systems and robotics.
Automation, control systems and robotics.
Telecommunications
Networking and communication equipment.
Networking and communication equipment.

