D01-C203-00801
Wafer Header, Horizontal, SMT, 8Pin

The Wafer Header Horizontal SMT 8Pin Connector provides a compact connection for wire to board applications. Featuring eight tin plated terminals at 2.00 mm pitch, its horizontal orientation supports convenient side entry mating. The PA6T housing meets UL94V-0 flammability requirements. Surface mount construction and tape and reel packaging support automated PCB assembly for a range of electronic devices.

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Product General Information
Component Type
Wafer Header
Mounting Style
Top-Mount
Contact Pin Type
SMT
Orientation
Horizontal
Product Specification
Physical Characteristics
Contact Count
8
Contact Material
Brass
Contact Plating
Tin
Pitch (mm)
2.0
Height (mm)
5.8
Housing Material
PA6T, UL94V-0
Housing Color
Ivory

Electrical Characteristics
Insulation Resistance
1000MΩ Min.
Current Rating
3A
Voltage Rating
250V
Dielectric Withstanding Voltage
800V AC/Min.
Contact Resistance
Initial 10mΩ Max. After 20mΩ Max.

Mechanical Characteristics
Insertion Force
7.5N Max.
Withdrawal Force
1.0N Min.
Durability
50 Cycles

Solder Process Characteristics
Solder Process Type
Reflow
Recommended Process Temperature
260°C 2 Seconds

Environmental
Operating Temperature Range
-25°C ~ +85°C
Storage Temperature Range
-25°C ~ +85°C
RoHS
RoHS 2.0
Halogen Free(HF) Compliance
Yes

Others
Packaging
Tape Reel

Key Features
Horizontal SMT Design
Supports side entry mating and surface mounting for PCB assembly.
Precise Contact Layout
Features eight tin plated terminals spaced at 2.00 mm pitch.
Flame Retardant Housing
PA6T housing meets UL94V-0 requirements for flame retardant insulation performance.
Typical Applications
Automotive
Vehicle electronics, EVs and infotainment systems.
Electronics
Consumer electronics and computing devices.
Industrial
Automation, control systems and robotics.
Medical
Medical devices and diagnostic equipment.
Telecommunications
Networking and communication equipment.