D01-C124-00901
USB 3.1 Type-A Receptacle, Elevated DIP, CH=12.58mm

The USB 3.1 Type-A Receptacle Elevated DIP CH=12.58 mm Connector supports SuperSpeed transmission through a durable through-hole interface. Its elevated 12.58 mm center height accommodates raised enclosure and PCB layouts while maintaining stable electrical performance. Strong DIP retention improves mechanical durability, making it suitable for consumer electronics, industrial equipment, networking devices, and embedded systems requiring frequent mating.

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Product General Information
Component Type
Receptacle
Mounting Style
Top-Mount
Contact Pin Type
DIP
Orientation
Elevated Right Angle
Product Specification

Physical Characteristics
Shell Material
SUS304, Ni Plating
Contact Count
9 Pin
Contact Material
C5191,C2680
Contact Plating
Gold
Pitch
2mm, 2.5mm
Housing Material
PA66 UL94-VO
Housing Color
Blue

Electrical Characteristics
Insulation Resistance
100MΩ Min.
Current Rating
1.8A For VBUS and GND pin, 0.25A For all other contacts
Voltage Rating
DC 5V
Dielectric Withstanding Voltage
100VAC/Min.
Contact Resistance
30mΩ Max. Initial for VBUS and GND, 50mΩ Max. Initial for all other contacts

Mechanical Characteristics
Insertion Force
35N Max.
Withdrawal Force
Initial 10N Min., After 8N Min.
Durability
5000 Cycles Min.

Solder Process Characteristics
Solder Process Type
Reflow
Recommended Process Temperature
260°C 5 ~ 10 Seconds

Environmental
Operating Temperature Range
-40°C ~ +85°C
Storage Temperature Range
-20°C ~ +85°C
RoHS
RoHS 2.0
Halogen Free(HF) Compliance
Yes

Others
Packaging
Tray

Key Features
USB 3.1 SuperSpeed Performance
Supports fast and stable USB 3.1 SuperSpeed data transmission.
Elevated 12.58 mm Profile
Accommodates raised enclosure and PCB height requirements precisely.
Robust DIP Mounting
Strengthens PCB retention for durable repeated mating performance.

Typical Applications
Automotive
Vehicle electronics, EVs and infotainment systems.
Electronics
Consumer electronics and computing devices.
Industrial
Automation, control systems and robotics.