Product General Information
Physical Characteristics
Electrical Characteristics
Mechanical Characteristics
Solder Process Characteristics
Environmental
Others
Key Features
USB 3.1 SuperSpeed Performance
Supports fast and stable USB 3.1 SuperSpeed data transmission.
Supports fast and stable USB 3.1 SuperSpeed data transmission.
Elevated 12.58 mm Profile
Accommodates raised enclosure and PCB height requirements precisely.
Accommodates raised enclosure and PCB height requirements precisely.
Robust DIP Mounting
Strengthens PCB retention for durable repeated mating performance.
Strengthens PCB retention for durable repeated mating performance.
Typical Applications
Automotive
Vehicle electronics, EVs and infotainment systems.
Vehicle electronics, EVs and infotainment systems.
Electronics
Consumer electronics and computing devices.
Consumer electronics and computing devices.
Industrial
Automation, control systems and robotics.
Automation, control systems and robotics.

