D12-0558-14004
I/O Receptacle, Right Angle, DIP

The I/O Receptacle Right Angle DIP Connector features a 14 position, 0.50 mm pitch design for compact board level interconnection. Its through hole mounting and metal shell provide stable PCB retention and mechanical durability. Rated at 0.5 A, it uses gold flash copper alloy contacts and a black UL94V-0 LCP housing for dependable electrical performance in electronic equipment and industrial systems with repeated mating.

Interested in This Product?
Add this product to your inquiry list and send us your requirements. Our team will get back to you with the information you need. If you can’t find exactly what you’re looking for, feel free to contact us.

Product General Information
Component Type
Receptacle
Mounting Style
Top-Mount
Contact Pin Type
DIP
Orientation
Right Angle
Product Specification

Physical Characteristics
Shell Material
Copper Alloy, Tin Alloy Plating
Contact Count
14
Contact Material
Copper Alloy
Contact Plating
Gold Flash
Pitch
0.5mm
Housing Material
LCP
Housing Color
Black

Electrical Characteristics
Insulation Resistance
1000MΩ Min. @ 250VDC
Current Rating
0.5A
Voltage Rating
5V
Dielectric Withstanding Voltage
100V AC/Min.
Contact Resistance
60mΩ Max.

Mechanical Characteristics
Insertion Force
50N Max.
Withdrawal Force
3N~30N Min.
Durability
5000 Cycles Min.

Solder Process Characteristics
Solder Process Type
Reflow
Recommended Process Temperature
260°C 5 ~ 10 Seconds

Environmental
Operating Temperature Range
-30°C ~ +60°C
Storage Temperature Range
-40°C ~ +85°C
RoHS
RoHS 2.0
Halogen Free(HF) Compliance
Yes

Others
Packaging
Tape Reel

Key Features
Compact 14 Position Design
The 0.50 mm pitch supports compact, high density PCB interconnection layouts.
Reliable Through Hole Mounting
DIP terminals and shell stakes provide strong PCB retention.
Stable Electrical Performance
Gold flash contacts support 0.5 A current and reliable conductivity.

Typical Applications
Electronics
Consumer electronics and computing devices.
Industrial
Automation, control systems and robotics.