Product General Information
Physical Characteristics
Electrical Characteristics
Mechanical Characteristics
Solder Process Characteristics
Environmental
Others
Key Features
Reverse Contact Configuration
Uses reverse facing contacts to meet specific PCB layout and mating requirements.
Uses reverse facing contacts to meet specific PCB layout and mating requirements.
DIP Through Hole Mounting
Provides strong PCB retention and reliable long term mechanical support.
Provides strong PCB retention and reliable long term mechanical support.
-0.3 mm Centre Height
Enables recessed integration while maintaining stable long term mating performance.
Enables recessed integration while maintaining stable long term mating performance.
Typical Applications
Electronics
Consumer electronics and computing devices.
Consumer electronics and computing devices.
Industrial
Automation, control systems and robotics.
Automation, control systems and robotics.
Telecommunications
Networking and communication equipment.
Networking and communication equipment.

