Product General Information
Physical Characteristics
Electrical Characteristics
Mechanical Characteristics
Solder Process Characteristics
Environmental
Others
Key Features
16-Position Dual-Row DIP Design
Dual-row DIP terminals provide secure and stable through-hole PCB mounting.
Dual-row DIP terminals provide secure and stable through-hole PCB mounting.
0.30 mm Elevated Center Height
Maintains mid-mount integration with a 0.30 mm elevated centerline.
Maintains mid-mount integration with a 0.30 mm elevated centerline.
10,000-Cycle Durability
Robust construction withstands at least 10,000 mating and unmating cycles.
Robust construction withstands at least 10,000 mating and unmating cycles.
Typical Applications
Electronics
Consumer electronics and computing devices.
Consumer electronics and computing devices.
Industrial
Automation, control systems, and robotics.
Automation, control systems, and robotics.
Telecommunications
Networking and communication equipment.
Networking and communication equipment.

